US Patent Issued to STATS ChipPAC on Jan. 13 for "Semiconductor device and method of forming dummy SOP within saw street" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,561, issued on Jan. 13, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming dummy SOP within saw street" was invented by KyuWon Lee (Gyeonggi-do, South Korea), JiWon Jang (Seoul, South Korea), Myeongjin Kim (Incheon, South Korea), HyeSun Kim (Incheon, South Korea), YoungDeuk Lee (Seoul, South Korea) and YoungJin Woo (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a semiconductor wafer or substrate including a plurality of semiconductor die. A plurality of first bumps is formed over an active surface of the semiconductor wafer. A plurality of second bumps...