US Patent Issued to STATS ChipPAC on Jan. 13 for "Semiconductor device and method of forming double-sided rectifying antenna on power module" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,518, issued on Jan. 13, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming double-sided rectifying antenna on power module" was invented by Chunhe Quan (Seoul, South Korea), JinYoung Lee (Incheon, South Korea) and Hyungwoo Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and a first electrical interconnect structure formed over a first surface of the substrate. A second electrical interconnect structure is formed over a second surface of the substrate. An electrical component is disposed over the first surface of the substrate or over the seco...