US Patent Issued to STATS ChipPAC on Jan. 13 for "Die-beam alignment for laser-assisted bonding" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,557, issued on Jan. 13, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Die-beam alignment for laser-assisted bonding" was invented by Wagno Alves Braganca Jr. (Incheon, South Korea), KyungOe Kim (Incheon, South Korea) and TaeKeun Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a semiconductor device involves the steps of disposing a first semiconductor die over a substrate and disposing a beam homogenizer over the first semiconductor die. A beam from the beam homogenizer impacts the first semiconductor die. The method further includes the steps of determining a positional offset of the beam relative...