US Patent Issued to STATS ChipPAC on Aug. 5 for "Semiconductor device and method of forming hybrid substrate with uniform thickness" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,141, issued on Aug. 5, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming hybrid substrate with uniform thickness" was invented by Yaojian Lin (Jiangsu Province, China), Linda Pei Ee Chua (Singapore), Jian Zuo (Singapore) and Hin Hwa Goh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a first hybrid substrate with a first thickness, and a second hybrid substrate with a second thickness different from the first thickness of the first hybrid substrate. An encapsulant is deposited around the first hybrid substrate and second hybrid substrate. A portion of the first hybrid...