US Patent Issued to STATS ChipPAC on Aug. 26 for "Semiconductor device and method of forming graphene-coated core embedded within TIM" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,929, issued on Aug. 26, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of forming graphene-coated core embedded within TIM" was invented by YongMoo Shin (Incheon, South Korea), HeeSoo Lee (Incheon, South Korea) and HyunSeok Park (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate and electrical component disposed over the substrate. The electrical component can be a semiconductor die, semiconductor package, surface mount device, RF component, discrete electrical device, or IPD. A TIM is deposited over the electrical component. The TIM has a core, such ...