US Patent Issued to STATS ChipPAC on Aug. 26 for "Semiconductor device and method of disposing electrical components over side surfaces of interconnect substrate" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,941, issued on Aug. 26, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of disposing electrical components over side surfaces of interconnect substrate" was invented by GunHyuck Lee (Incheon, South Korea), HeeSoo Lee (Incheon, South Korea), SangHyun Son (Seoul, South Korea) and Bokyeong Hwang (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has an interconnect substrate with a conductive via. A first electrical component is disposed over a major surface of the interconnect substrate. An electrical interconnect compound is disposed over the conductive via exposed from a ...