US Patent Issued to STATS ChipPAC on Aug. 19 for "Semiconductor device and method of processing strip of electrical components using mesh jig" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,637, issued on Aug. 19, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of processing strip of electrical components using mesh jig" was invented by JoonSung Park (Incheon, South Korea), JiSu Han (Incheon, South Korea) and WonSang Rhee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has an interconnect substrate and an electrical component disposed over the substrate. A first carrier including a window is disposed over the interconnect substrate with the electrical component disposed within the window. A second carrier is disposed over the first carrier with a pluralit...