US Patent Issued to STATS ChipPAC on Aug. 19 for "Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packages" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,727, issued on Aug. 19, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packages" was invented by ChangOh Kim (Incheon, South Korea), KyoungHee Park (Seoul, South Korea), SeongHwan Park (Incheon, South Korea) and JinHee Jung (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a first package layer. A first shielding layer is formed over the first package layer. The first shielding layer is patterned to form a redistribution layer. An electrical component i...