US Patent Issued to STATS ChipPAC on Aug. 12 for "Cooling device and process for cooling double-sided SiP devices during sputtering" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,385,128, issued on Aug. 12, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Cooling device and process for cooling double-sided SiP devices during sputtering" was invented by OhHan Kim (In-cheon, South Korea), HunTeak Lee (Gyeongi-do, South Korea), Sell Jung (Incheon, South Korea) and HeeSoo Lee (Kyunggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes ...