US Patent Issued to STATS ChipPAC on April 29 for "Semiconductor device with partial EMI shielding and method of making the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,753, issued on April 29, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device with partial EMI shielding and method of making the same" was invented by ChangOh Kim (Incheon, South Korea), KyoungHee Park (Seoul, South Korea), KyoWang Koo (Incheon, South Korea) and SungWon Cho (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and...