US Patent Issued to STATS ChipPAC on April 29 for "Semiconductor device and method of stacking devices using support frame" (South Korean Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,754, issued on April 29, was assigned to STATS ChipPAC Pte. Ltd. (Singapore).

"Semiconductor device and method of stacking devices using support frame" was invented by GunHyuck Lee (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a first substrate and a first electrical component disposed over the first substrate. A first support frame is disposed over the first substrate. The first support frame has a horizontal support channel extending across the first substrate and a vertical support brace extending from the horizontal support channel to the first substrate. The first support frame can have a vertica...