ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,425,759, issued on Sept. 23, was assigned to ST R&DTech LLC (Delray Beach, Fla.).
"Multi-mic earphone design and assembly" was invented by John Keady (Fairfax Station, Va.).
According to the abstract* released by the U.S. Patent & Trademark Office: "At least one exemplary embodiment is directed to a method of earphone manufacturing with an ear canal microphone, ambient sound microphone and a speaker, where the earphone has parts that have been 3D printed."
The patent was filed on Jan. 14, 2022, under Application No. 17/576,905.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnet...