US Patent Issued to South China University of Technology on April 22 for "Si-containing high-strength and low-modulus medical titanium alloy, and additive manufacturing method and use thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,280,426, issued on April 22, was assigned to South China University of Technology (Guangzhou, China).

"Si-containing high-strength and low-modulus medical titanium alloy, and additive manufacturing method and use thereof" was invented by Yuanyuan Li (Guangzhou, China), Chao Yang (Guangzhou, China), Xuan Luo (Guangzhou, China), Dongdong Li (Changchun, China), Yanguo Qin (Changchun, China) and Ning Li (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a Si-containing high-strength and low-modulus medical titanium alloy, and an additive manufacturing method and use thereof. The additive manufacturing method compris...