ALEXANDRIA, Va., June 6 -- United States Patent no. 12,281,383, issued on April 22, was assigned to SOULBRAIN Co. LTD. (Gyeonggi-do, South Korea).
"Indium precursor compound, method of preparing thin film using the same, and board prepared using the same" was invented by Chang Bong Yeon (Gyeonggi-do, South Korea), Jin Hee Kim (Gyeonggi-do, South Korea), Jae Sun Jung (Gyeonggi-do, South Korea) and Seok Jong Lee (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to an indium precursor compound, a method of preparing a thin film using the same, and a board prepared using the same. More particularly, the present invention relates to an indium precursor compound...