ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,781, issued on March 25, was assigned to SOOCHOW UNIVERSITY (Suzhou, China).
"STL model slicing method and device" was invented by Yihuai Wang (Suzhou, China), Tingting Xu (Suzhou, China), Jin Wang (Suzhou, China), Lianmin Shi (Suzhou, China) and Rong Zhang (Suzhou, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "An STL model slicing method includes: reading and loading an STL model; obtaining a first slice plane; according to a first set thickness, making the first slice plane be horizontally tangential to an STL model to obtain a first profile curve, which is a profile curve of a tangent plane of the STL model and the first slice plane; dete...