US Patent Issued to SONY SEMISCONDUCTOR SOLUTIONS on July 8 for "Imaging apparatus and manufacturing method of the same" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,737, issued on July 8, was assigned to SONY SEMISCONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Imaging apparatus and manufacturing method of the same" was invented by Mutsuo Tsuji (Kanagawa, Japan) and Daisuke Chino (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An imaging apparatus includes an imaging element, a wiring substrate, a sealing section, and fitting sections. The imaging element includes an imaging chip and pads. A light transmission section that transmits incident light is arranged on the imaging chip, and the imaging chip generates an image signal based on the incident light that has transmitted through the light transm...