US Patent Issued to Sony Semiconductor Solutions on Sept. 9 for "Solid-state imaging device and solid-state imaging apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,390, issued on Sept. 9, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging device and solid-state imaging apparatus" was invented by Hironobu Fukui (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging device including: a semiconductor substrate having a first surface and a second surface opposed to each other, and including a photoelectric converter provided for each of pixel regions; an impurity diffusion region provided, for each of the pixel regions, in proximity to the first surface of the semiconductor substrate; and a contact electrode embedded in the semiconductor subst...