US Patent Issued to Sony Semiconductor Solutions on Sept. 9 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,308, issued on Sept. 9, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Takashi Yokoyama (Kanagawa, Japan), Taku Umebayashi (Kanagawa, Japan) and Nobutoshi Fujii (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to an embodiment of the present disclosure includes: a first substrate provided with an active element; and a second substrate laminated with the first substrate and electrically coupled to the first substrate, in which the second substrate is provided with a first transistor configurin...