US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Sept. 9 for "Semiconductor device and manufacturing method of the same" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,753, issued on Sept. 9, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor device and manufacturing method of the same" was invented by Tsuyoshi Watanabe (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Restrictions in placement of an antenna for performing transmission and reception of a signal by wireless communication when the antenna is used together with a CSP (Chip Size Package) are eliminated. A semiconductor device includes a chip size package and a substrate. The chip size package includes a semiconductor element. Further, the chip size package includes a connection portion that electrically...