US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Sept. 9 for "Semiconductor device, semiconductor module, and wireless communication apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,319, issued on Sept. 9, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor device, semiconductor module, and wireless communication apparatus" was invented by Kazuki Kishida (Kanagawa, Japan) and Katsuhiko Takeuchi (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including: a channel layer; a barrier layer; a source electrode and a drain electrode; a gate electrode; a side surface opening region; and a low-Ns region. The channel layer includes a first nitride semiconductor. The barrier layer includes a second nitride semiconductor. The barrier layer is provided on the channel l...