ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,472, issued on Sept. 30, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).
"Solid-state imaging device and electronic instrument" was invented by Eriko Kato (Kanagawa, Japan) and Akihiko Kato (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To reduce the number of wirings through which transmission and reception are made between chips.The solid-state imaging device includes a first substrate including a pixel array unit in which a plurality of pixels is arranged, each of the plurality of pixels including a photoelectric conversion unit, and the first substrate includes a first wiring through which an imaging pixel...