ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,434, issued on Sept. 30, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).
"Sensor module and case unit" was invented by Haruki Tanaka (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor module according to an embodiment of the present technology includes a sensor element, a first case, a second case, and an intermediate layer. The first case includes an opening end and accommodates therein the sensor element. The second case includes a joining surface welded to the opening end. The intermediate layer is reflective of light, and is formed along an outer peripheral edge of a region, in the opening end, in whi...