ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,284, issued on Sept. 23, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).
"Sensor module" was invented by Hirofumi Owaki (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "[Object] To provide a sensor module and a method for producing the sensor module, the sensor module making it possible to improve a degree of freedom in design, to facilitate the operation, and to reduce costs by reducing the number of components.[Solving Means] A sensor module according to an embodiment of the present technology includes a first member, a second member, a third member, and a sensor element. The first member is made of a syntheti...