US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Sept. 2 for "Semiconductor apparatus and manufacturing method for semiconductor apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,408,376, issued on Sept. 2, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor apparatus and manufacturing method for semiconductor apparatus" was invented by Yushi Koriyama (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor apparatus which can achieve high reliability while reducing parasitic capacitance and can prevent a gate leakage defect while suppressing an increase in manufacturing costs. The semiconductor apparatus includes a substrate having a buried insulating film and a semiconductor layer provided on the buried insulating film and formed with a semiconductor element, ...