ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,721, issued on Oct. 7, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).
"Solid-state imaging device" was invented by Tokihisa Kaneguchi (Kanagawa, Japan) and Kan Shimizu (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging device that includes a first substrate, one or multiple second substrates, a first wiring layer, a second wiring layer, and a first alignment part. The first substrate includes a first semiconductor substrate with multiple photoelectric conversion sections, and a multilayer wiring layer. The one or multiple second substrates are attached to the first substrate with the multilaye...