US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Oct. 28 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,669, issued on Oct. 28, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor device" was invented by Yuto Tanaka (Kanagawa, Japan), Shuichi Oka (Kanagawa, Japan), Shun Mitarai (Kanagawa, Japan), Kiwamu Adachi (Kanagawa, Japan), Takahiro Igarashi (Kanagawa, Japan), Hiizu Ohtorii (Kanagawa, Japan), Naoki Kakoiyama (Kanagawa, Japan), Kousuke Seki (Kanagawa, Japan) and Hiroyuki Shigeta (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device capable of maintaining the flatness of a glass substrate and sufficiently protecting an end portion of the glass substrate. The semiconductor...