US Patent Issued to Sony Semiconductor Solutions on Oct. 14 for "Stacked light-receiving sensor and in-vehicle imaging device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,350, issued on Oct. 14, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Stacked light-receiving sensor and in-vehicle imaging device" was invented by Ryoji Eki (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Advanced processing is performed in a chip. A stacked light-receiving sensor according to an embodiment includes a first substrate (100, 200, 300), a second substrate (120, 320) bonded to the first substrate, and connection wiring (402) bonded to the second substrate. The first substrate includes a pixel array (101) in which a plurality of unit pixels are arranged in a two-dimensional matrix. The second sub...