US Patent Issued to Sony Semiconductor Solutions on Oct. 14 for "Solid-state imaging element, manufacturing method, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,348, issued on Oct. 14, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging element, manufacturing method, and electronic device" was invented by Satoru Wakiyama (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a solid-state image sensor, a manufacturing method, and an electronic device that enable control of a wafer process and a chip size package (CSP) process even with no cover glass. A CIS wafer and a logic wafer including a logic circuit or a memory circuit are stacked and bonded. The CIS wafer and the logic wafer are electrically connected via a through ele...