US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Nov. 4 for "Semiconductor apparatus and semiconductor apparatus manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,841, issued on Nov. 4, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor apparatus and semiconductor apparatus manufacturing method" was invented by Toshihiko Miyazaki (Kanagawa, Japan), Yuki Kawahara (Kanagawa, Japan), Tsuyoshi Suzuki (Kanagawa, Japan) and Tadashi Iijima (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor apparatus that makes it possible to suppress propagation of noise and heat between elements formed in upper and lower substrates in a stacked structure of plural substrates and suppress deterioration of characteristics of the elements is provided. The semiconductor appa...