US Patent Issued to Sony Semiconductor Solutions on Nov. 25 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,754, issued on Nov. 25, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Hiroyuki Kawashima (Kanagawa, Japan), Ryoichi Nakamura (Kanagawa, Japan), Yoshihisa Kagawa (Kanagawa, Japan) and Yuusaku Kobayashi (Nagasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to an embodiment of the present disclosure includes: a first substrate including a first junction portion; and a second substrate including a second junction portion. The second junction portion is joined to the first junction portion. The first s...