US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on May 6 for "Radio frequency module and wireless device" (Japanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,294,152, issued on May 6, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Radio frequency module and wireless device" was invented by Takahiro Igarashi (Kanagawa, Japan) and Shusaku Yanagawa (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a radio frequency module including: an interposer; a plurality of antenna element groups that include first electrodes and a second electrode and are configured such that the first electrodes are aligned in line shapes in at least a first direction on a first surface of the interposer; and meta material portions that are provided at the interposer an...