US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on May 27 for "Semiconductor apparatus and semiconductor apparatus manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,627, issued on May 27, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor apparatus and semiconductor apparatus manufacturing method" was invented by Tadashi Iijima (Kanagawa, Japan) and Yuki Miyanami (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor apparatus that can realize further enhancement of capabilities regarding a stacked structure of plural substrates. The semiconductor apparatus includes a first substrate that includes a first element layer including a first active element, and a first wiring layer arranged on the first element layer; and a second substrate that ...