US Patent Issued to Sony Semiconductor Solutions on May 27 for "Semiconductor apparatus and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,612, issued on May 27, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor apparatus and method for manufacturing the same" was invented by Nobutoshi Fujii (Kanagawa, Japan), Koichi Sejima (Kanagawa, Japan), Koichiro Saga (Kanagawa, Japan) and Shinichi Miyake (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus and method enabling a reduction in a resistance of a conductive path electrically connecting an upper substrate and a lower substrate. The apparatus includes a first semiconductor layer with element formation regions disposed adjacent to one another via element isolation regions, each o...