US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on May 20 for "Semiconductor package, semiconductor package manufacturing method, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,132, issued on May 20, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor package, semiconductor package manufacturing method, and electronic device" was invented by Mitsuhito Kanatake (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To arrange a protective material horizontally with respect to a substrate plane without the protective material coming into contact with wires in a wire-bonded semiconductor package.The semiconductor package includes a protective material, a substrate, bumps, and a semiconductor chip. The bumps are provided on a chip plane of the semiconductor chip and are connected to th...