US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on May 13 for "Compound semiconductor device and method of manufacturing compound semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,745, issued on May 13, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Compound semiconductor device and method of manufacturing compound semiconductor device" was invented by Akito Iwao (Kumamoto, Japan) and Yoshikazu Motoyama (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a compound semiconductor device that can suppress the deterioration of the element characteristics and a method of manufacturing a compound semiconductor device. The compound semiconductor device includes a laminated body constituted of a compound semiconductor and including a channel layer in which a first conductivity type car...