US Patent Issued to Sony Semiconductor Solutions on March 4 for "Imaging apparatus and imaging method, camera module, and electronic apparatus capable of detecting a failure in a structure in which substrates are stacked" (Japanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,244,944, issued on March 4, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Imaging apparatus and imaging method, camera module, and electronic apparatus capable of detecting a failure in a structure in which substrates are stacked" was invented by Takumi Oka (Kanagawa, Japan), Atsushi Suzuki (Kanagawa, Japan) and Naoki Kawazu (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an imaging apparatus and an imaging method, a camera module, and an electronic apparatus that are capable of detecting a failure in an imaging device having a structure in which a plurality of substrates are sta...