US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on March 18 for "Semiconductor package, electronic apparatus, and method for manufacturing semiconductor package" (Japanese Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,170, issued on March 18, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor package, electronic apparatus, and method for manufacturing semiconductor package" was invented by Yasushi Otsuka (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor package in which a semiconductor element is connected to a substrate, the semiconductor element is prevented from being warped. The semiconductor package includes a substrate, the semiconductor element, a bonding portion, and protrusions. First ends of wires are connected to a front surface of the substrate. Second ends of wires are connected to o...