US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on June 3 for "Solid-state imaging device and imaging method" (Japanese Inventor)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,297, issued on June 3, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging device and imaging method" was invented by Satoshi Keino (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging device includes an imaging element array that includes M imaging elements arranged in a first direction and N imaging elements arranged in a second direction, that is, MxN imaging elements in total, each of the imaging elements including a photoelectric conversion unit that includes a photoelectric conversion layer 21, an insulation layer 32, a charge discharge electrode 22, an upper electrode 23, ...