US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on June 17 for "Solid-state imaging device and electronic device including coupling structures for electrically interconnecting stacked semiconductor substrates" (Japanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,317, issued on June 17, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Solid-state imaging device and electronic device including coupling structures for electrically interconnecting stacked semiconductor substrates" was invented by Hideto Hashiguchi (Kanagawa, Japan), Reijiroh Shohji (Kanagawa, Japan), Hiroshi Horikoshi (Kanagawa, Japan), Ikue Mitsuhashi (Kanagawa, Japan), Tadashi Iijima (Kanagawa, Japan), Takatoshi Kameshima (Kanagawa, Japan), Minoru Ishida (Kanagawa, Japan) and Masaki Haneda (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a solid-state imaging device and an electronic apparatus w...