US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on June 17 for "Semiconductor device and manufacturing method of semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,460, issued on June 17, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor device and manufacturing method of semiconductor device" was invented by Takuya Nakamura (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a pad, a diffusion layer, and a melting layer. The pad included by the semiconductor device includes a concave portion on a surface at which solder connection is to be performed. The diffusion layer included by the semiconductor device is disposed at the concave portion and constituted with a metal which remains on the surface of the pad while diffusing into so...