ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,923, issued on July 8, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).
"Semiconductor device" was invented by Susumu Hogyoku (Kanagawa, Japan), Shinya Morita (Kanagawa, Japan), Rei Takamori (Kumamoto, Japan) and Shuichi Oka (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device enabling the flatness of a glass substrate to be maintained and enabling the end portion of the glass substrate to be sufficiently protected. A semiconductor device according to the present disclosure includes a glass substrate that includes a first surface, a second surface provided on the opposite side of the ...