US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on July 1 for "Semiconductor device, electric circuit, and wireless communication apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,385, issued on July 1, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor device, electric circuit, and wireless communication apparatus" was invented by Masashi Yanagita (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a channel layer, a barrier layer, and at least one contact layer. The channel layer includes a GaN-based material. The barrier layer includes an AlInN-based material in which a composition ratio of In is higher than 18%, and is provided on the channel layer. The at least one contact layer includes a conductive-type semiconductor material and is provided t...