US Patent Issued to Sony Semiconductor Solutions on July 1 for "Backside illumination type solid-state imaging device, manufacturing method for backside illumination type solid-state imaging device, imaging apparatus and electronic equipment" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,482, issued on July 1, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Backside illumination type solid-state imaging device, manufacturing method for backside illumination type solid-state imaging device, imaging apparatus and electronic equipment" was invented by Taizo Takachi (Kanagawa, Japan), Yuichi Yamamoto (Kanagawa, Japan), Suguru Saito (Kanagawa, Japan), Satoru Wakiyama (Kanagawa, Japan), Yoichi Ootsuka (Kumamoto, Japan), Naoki Komai (Kanagawa, Japan), Kaori Takimoto (Kanagawa, Japan), Tadashi Iijima (Kanagawa, Japan), Masaki Haneda (Kanagawa, Japan) and Masaya Nagata (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Tradem...