US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Jan. 27 for "Semiconductor device, solid-state imaging device, and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,603, issued on Jan. 27, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan).

"Semiconductor device, solid-state imaging device, and method of manufacturing semiconductor device" was invented by Takuya Kurotori (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a multilayered wiring layer including an insulation layer (30) and a diffusion prevention layer (21, 22, 23, 24) stacked alternately and including a wiring layer (11, 12, 13) internally; a gap section (50) disposed at least in a portion of the insulation layer (30); and a support section (60) disposed at least in a portion of the g...