US Patent Issued to Sony Semiconductor Solutions on Jan. 27 for "Imaging element, laminated imaging element, and solid-state imaging device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,604, issued on Jan. 27, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Imaging element, laminated imaging element, and solid-state imaging device" was invented by Nobuhiro Kawai (Kanagawa, Japan), Hideaki Togashi (Nagasaki, Japan), Fumihiko Koga (Kanagawa, Japan), Tetsuji Yamaguchi (Kanagawa, Japan), Shintarou Hirata (Tokyo), Taiichiro Watanabe (Kanagawa, Japan) and Yoshihiro Ando (Nagasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A solid-state imaging element includes a pixel including a first imaging element, a second imaging element, a third imaging element, and an on-chip micro lens 90. The first imaging elem...