ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,591, issued on Jan. 27, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).
"Imaging device" was invented by Hidenobu Tsugawa (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a semiconductor device, a manufacturing method, an imaging element, and an electronic device capable of reducing manufacturing steps in a stacked structure obtained by stacking two or more semiconductor substrates. The semiconductor device has a stacked structure obtained by stacking at least a first semiconductor substrate in which a first wiring layer is stacked on a first semiconductor layer and a second semi...