US Patent Issued to Sony Semiconductor Solutions on Jan. 13 for "Solid-state imaging element, method of manufacturing solid-state imaging element, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,553, issued on Jan. 13, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Solid-state imaging element, method of manufacturing solid-state imaging element, and electronic device" was invented by Harumi Tanaka (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An imaging device includes a photoelectric conversion region disposed in a substrate having a first conductivity type. The imaging device includes a first region having a second conductivity type and disposed in the substrate at a first side of the photoelectric conversion region in a cross sectional view, where the first side of the photoelectric conversion re...