US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on Jan. 13 for "Image sensor assembly, solid-state imaging device and time-of-flight sensor assembly" (German Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,544, issued on Jan. 13, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Atsugi, Japan).

"Image sensor assembly, solid-state imaging device and time-of-flight sensor assembly" was invented by Noam Eshel (Stuttgart, Germany) and Golan Zeituni (Stuttgart, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor assembly includes a pixel circuit including a charge storage structure and an amplification transistor. A load path of the amplification transistor is between an amplifier drain line and a pixel output node. A potential at a storage node of the charge storage structure controls the amplification transistor. An amplifier drain c...