US Patent Issued to Sony Semiconductor Solutions on Feb. 4 for "Semiconductor device, and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,237, issued on Feb. 4, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor device, and method for manufacturing semiconductor device" was invented by Yuki Yanagisawa (Kanagawa, Japan) and Takashi Futatsuki (Kagoshima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a semiconductor device including: a semiconductor substrate; a gate insulating film provided on the semiconductor substrate; a gate electrode layer that is provided on the gate insulating film and contains impurity ions; and source or drain regions that are provided on the semiconductor substrate on both sides of the gate electrode la...