US Patent Issued to Sony Semiconductor Solutions on Dec. 9 for "Camera module and electronic device with heat dissipating member" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,192, issued on Dec. 9, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Camera module and electronic device with heat dissipating member" was invented by Shunichiro Shibazaki (Kanagawa, Japan), Kozo Hoshino (Kanagawa, Japan), Shinichi Yuzuki (Kanagawa, Japan), Tetsuya Nakagawa (Kanagawa, Japan), Kiyohiro Saito (Kanagawa, Japan), Yuta Shishido (Kanagawa, Japan), Kazumi Kobayashi (Kanagawa, Japan), Nobuyuki Watanabe (Kanagawa, Japan) and Masaki Hoshino (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a camera module and an electronic device that can improve heat dissipation. A movab...